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593202B03500G by boyd laconia llc
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593202B03500G

Boyd Laconia LLC

The 593202B03500G is a staggered fin, board-level heat sink designed for cooling TO-220 and TO-220-single gauge semiconductor devices. ...

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RoHS Compliant
Bulk Packaging
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DESCRIPTION

The 593202B03500G is a board-level heat sink from the Space Saving 5932 series, engineered for thermal management of TO-220 and TO-220-single gauge devices. Constructed from aluminum with a black anodize finish for durability and performance, it measures 35.05 mm in width, 12.20 mm in length, and 50.80 mm in height. This component features a staggered fin design for efficient heat dissipation and is intended for vertical mounting. It is ideal for applications requiring effective cooling of power components in space-constrained board-level environments and requires a separate mounting kit for device attachment.

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SPECIFICATIONS

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Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
593202B03500G
Alias/AKA:
042686
Unit of Measure:
Per Each
RoHS:
Yes
HTS:
8473309000
COO:
CN
ECCN:
EAR99
Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
800
Package Type:
Bulk
Device Cooled:
TO-220
Attachment Method:
N/A
Dimension:
35.05 x 12.2 x 50.8mm
Thermal Resistance:
10.4 °C/W
Finish:
Black Anodized

IN STOCK: 835

Can Ship immediately

On Order: 8,000   can ship 5/29/26 

MOQ for In Stock Qty: 5

MOQ for out of Stock Qty: 400

Factory Lead-Time 8 Weeks

Qty
Unit Price
5
$2.776
100
$0.708
250
$0.694
400
$0.667
800
$0.649
1,200
$0.646
1,600 +
$0.642
Suppliers Standard Package
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