577202B04000G
Boyd Laconia LLCThe 577202B04000G is an aluminum, channel-style board level heat sink designed for cooling TO-220 and TO-220-single gauge semiconductor devices. ...
DESCRIPTION
The 577202B04000G is a channel board level heat sink intended for the thermal management of TO-220 and TO-220-single gauge devices. Constructed from aluminum with a black anodize finish, this heat sink has a length of 12.7 mm, a width of 13.21 mm, and a height of 19.05 mm. It requires a mounting kit for device attachment and offers versatile integration. Its design supports both horizontal and vertical mounting orientations, making it suitable for various board-level cooling applications where efficient heat dissipation is critical.
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SPECIFICATIONS
IN STOCK: 128
Can Ship immediately
On Order:
15,000
can ship 5/22/26
MOQ for In Stock Qty: 10
MOQ for out of Stock Qty: 1250
Factory Lead-Time 9 Weeks
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