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574902B03300G by boyd laconia llc
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574902B03300G

Boyd Laconia LLC

Heat Sink Passive TO-220 Thru-Hole Aluminum 16A°C/W Black Anodized ...

Datasheet
RoHS Compliant
Bulk Packaging
Accessories
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DESCRIPTION

574902B03300G is a slide-on board level heat sink from the Slide On 5740 series, engineered to cool TO-220 and TO-220-single gauge (0.020") semiconductor devices. The heat sink is constructed from aluminum with a black anodize finish and features a spring action slide-on attachment mechanism for secure device mounting. Key dimensional specifications include a heat sink height of 34.93 mm, width of 21.84 mm, and length of 9.02 mm, with mounting hole dimensions of X: 10.54 mm, Y: 3.05 mm, and Z: 1.91 mm. The product supports both horizontal and vertical mounting orientations, providing flexibility in thermal management system design. This heat sink is ideal for applications requiring efficient thermal dissipation from power semiconductor devices in compact board-level configurations.

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SPECIFICATIONS

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Supplier:
Boyd Laconia LLC
Part No:
574902B03300G
Alias/AKA:
042351
Unit of Measure:
Per Each
RoHS:
Yes
HTS:
8536694040
COO:
CN
ECCN:
EAR99
Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
1500
Package Type:
Bulk
Device Cooled:
TO-2206707
Attachment Method:
Screw6706
Dimension:
21.84 x 10.03 x 34.936714mm
Thermal Resistance:
166717°C/W
Finish:
Black Anodized6710

IN STOCK: 1,052

Can Ship immediately

Minimum Order Quantity: 10

Factory Lead-Time 6 Weeks

Price (USD)

Qty
Unit Price
10
$4.343
50
$3.948
100
$3.771
250
$3.565
500
$3.419
1,500
$3.225
3,000
$3.217
6,000 +
$3.209
Suppliers Standard Package
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