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573100D00010G by boyd laconia llc
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573100D00010G

Boyd Laconia LLC

Heat Sink Passive D PAK/TO-252 SMD Aluminum 25A°C/W Tin ...

Datasheet
RoHS Compliant
REEL Packaging
Accessories
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DESCRIPTION

The 573100D00010G is a surface mount board level heat sink engineered to dissipate heat from D-Pak and TO-252 packaged semiconductor devices. Constructed from aluminum with a tin-plated finish, this heat sink features dimensions of 8.00 mm width × 10.16 mm length × 22.86 mm height and is mounted horizontally on the printed circuit board. The design includes a recommended copper heat spreader drain pad (14.0 mm × 9.5 mm) and solder mask opening (13.5 mm × 8.9 mm) to optimize thermal coupling and board integration. This heat sink is ideal for applications requiring efficient thermal management of power semiconductors in compact surface-mount assemblies, offering improved heat dissipation performance across varying air velocity conditions.

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SPECIFICATIONS

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Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
573100D00010G
Alias/AKA:
041639
Unit of Measure:
Per Each
RoHS:
Yes
HTS:
8536694040
COO:
CN
ECCN:
EAR99
Reel Pack: This product ships on a reel. Depending on the quantity ordered, you may receive full factory reels, cut tape (components on a strip cut from a reel), or a combination of both.
1
Package Type:
REEL
Device Cooled:
D PAK6707,TO-2526707
Attachment Method:
Surface Mount6706
Dimension:
22.86 x 8 x 10.166714mm
Thermal Resistance:
256717°C/W
Finish:
Tin6710

IN STOCK: 4,525

Can Ship immediately

MOQ for In Stock Qty: 10

MOQ for out of Stock Qty: 1125

Factory Lead-Time 9 Weeks

Price (USD)

Qty
Unit Price
10
$1.100
250
$0.977
500
$0.943
1,125
$0.922
2,250
$0.917
3,375
$0.913
4,500 +
$0.908
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