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532602B02500G by boyd laconia llc
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532602B02500G

Boyd Laconia LLC

The 532602B02500G is an extruded aluminum, dual radial board-level heat sink designed for cooling TO-220 and TO-220-single gauge devices. ...

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RoHS Compliant
Bulk Packaging
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DESCRIPTION

The 532602B02500G is a dual radial board-level heat sink intended for cooling TO-220 and TO-220-single gauge semiconductor packages. Constructed from aluminum with a black anodize finish, it provides effective thermal management for high-power components. This heat sink is designed for vertical mounting and has dimensions of 41.91 mm in width, 25.40 mm in length, and 38.10 mm in height. It is suitable for board-level cooling applications where efficient heat dissipation is critical for system reliability and performance.

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SPECIFICATIONS

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Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
532602B02500G
Alias/AKA:
041681
Unit of Measure:
Per Each
RoHS:
Yes
HTS:
8473305100
COO:
CN
ECCN:
EAR99
Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
1
Package Type:
Bulk
Device Cooled:
TO-220
Attachment Method:
N/A
Dimension:
41.91 x 25.4 x 38.1 mm
Thermal Resistance:
5.5 °C/W
Finish:
Black Anodized

IN STOCK: 100

Ships today, if you order in

On Order: 2,040   can ship 5/29/26 

Minimum Order Quantity: 5

Factory Lead-Time 9 Weeks

Qty
Unit Price
5
$3.742
25
$2.950
50
$2.711
240
$2.429
480
$2.361
720
$2.355
1,200
$2.283
4,080 +
$2.277
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