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374724B60024G by boyd laconia llc
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374724B60024G

Boyd Laconia LLC

Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3A°C/W Black Anodized ...

Datasheet
RoHS Compliant
Packaging
Accessories
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DESCRIPTION

374724B60024G is a square pin fin board level heat sink designed to cool BGA and FPGA devices. Constructed from aluminum with a black anodize finish, this heat sink measures 35.0 mm x 35.0 mm x 18.0 mm and features a solder anchor clip attachment method with T766 Chomerics phase change thermal interface material for all surfaces. The mounting configuration requires 4 plated through holes with 0.97 ± 0.03 mm diameter, supporting both horizontal and vertical mounting orientations. This RoHS compliant heat sink is ideal for board level cooling applications requiring efficient thermal management of high-performance processors and programmable logic devices.

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SPECIFICATIONS

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Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
374724B60024G
Alias/AKA:
306220
Unit of Measure:
Per Each
RoHS:
Yes
HTS:
8542900000
COO:
CN
ECCN:
EAR99
Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
168
Device Cooled:
BGA6707,FPGA6707
Attachment Method:
Solder Anchor6706
Dimension:
35 x 35 x 186714mm
Thermal Resistance:
15.36717°C/W
Finish:
Black Anodized6710

IN STOCK: 1,412

Can Ship immediately

Minimum Order Quantity: 10

Factory Lead-Time 6 Weeks

Price (USD)

Qty
Unit Price
10
$6.29
50
$5.86
168
$5.45
336
$5.23
504
$5.12
1,008
$4.93
2,520
$4.92
5,040 +
$4.91
Suppliers Standard Package
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