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043409 by boyd laconia llc
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043409

Boyd Laconia LLC

Heat Sink Passive BGA Anchor ...

Datasheet
RoHS Compliant
Packaging
Accessories
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This product is backed by Master Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Certificate of Compliance Guarantee

DESCRIPTION

125800D00000G is a BGA solder anchor designed for securing heat sink clips to printed circuit boards. This solder anchor is specifically engineered for PCB thicknesses of 0.100 to 0.110 inches and features an "A" dimension of 4.70 mm (0.185 inches). The product is RoHS compliant and requires 2 to 4 solder anchors to be soldered to the PCB prior to attaching the heat sink clip. Key dimensional specifications include a height of 7.19 mm (0.283 inches), a base width of 7.62 mm (0.300 inches), and a stem diameter of 0.64 mm (0.025 inches). This solder anchor is ideal for thermal management applications where reliable mechanical attachment of heat sinks to BGA packages is required.

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SPECIFICATIONS

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Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
043409
Alias/AKA:
125800D00000G
Unit of Measure:
Per Each
RoHS:
Yes
COO:
CN
ECCN:
EAR99
Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
50000

IN STOCK: 1,852

Can Ship immediately

MOQ for In Stock Qty: 100

MOQ for out of Stock Qty: 12500

Factory Lead-Time 6 Weeks

Price (USD)

Qty
Unit Price
100
$0.4021
2,500
$0.3824
5,000
$0.3805
7,500
$0.3795
12,500
$0.3786
25,000
$0.3777
37,500
$0.3266
50,000 +
$0.3202
Suppliers Standard Package
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