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043181 by boyd laconia llc
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043181

Boyd Laconia LLC

Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 23.4A°C/W Black Anodized ...

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RoHS Compliant
Packaging
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DESCRIPTION

The 374624B00032G is a square pin fin board level heat sink engineered to cool BGA and FPGA devices. It is constructed from aluminum with a black anodize finish and features a compact footprint of 35.00 mm × 35.00 mm with a height of 10.00 mm, supporting both horizontal and vertical mounting orientations. The device attaches via tape and uses T405R Chomerics thermal interface material optimized for metal surfaces, ensuring efficient heat transfer from the mounted component to the ambient environment. This heat sink is ideal for high-density circuit board applications where space is limited and reliable thermal management is essential for maintaining device performance and longevity.

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SPECIFICATIONS

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Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
043181
Alias/AKA:
374624B00032G
Unit of Measure:
Per Each
RoHS:
Yes
HTS:
8419505000
COO:
CN
ECCN:
EAR99
Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
510

IN STOCK: 769

Can Ship immediately

Minimum Order Quantity: 10

Factory Lead-Time 6 Weeks

Price (USD)

Qty
Unit Price
10
$2.33
50
$2.22
250
$2.12
510
$2.07
1,020
$2.03
2,550
$1.92
5,100 +
$1.88
Suppliers Standard Package
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