042236
Boyd Laconia LLCHeat Sink Passive TO-220 Twisted Clip Aluminum 6.3A°C/W Black Anodized ...
DESCRIPTION
530102B00150G is a board level heat sink from the High Rise 5301 series, specifically designed to cool TO-220 semiconductor devices. The heat sink features twisted fins and wave-on mounts for enhanced thermal performance, with a vertical mounting orientation and clip attachment using Kool Clip Code 50. Constructed from aluminum with black anodize finish, it measures 44.45 mm in width and height with a length of 12.45 mm, and includes an "A" dimension of 18.29 mm for device positioning. This heat sink is ideal for applications requiring efficient thermal management of TO-220 packaged components in board-level cooling solutions, offering reliable heat dissipation through its optimized fin geometry and secure clip-based mounting system.
Search Keywords: 042236
SPECIFICATIONS
IN STOCK: 760
Can Ship immediately
Minimum Order Quantity: 5
Factory Lead-Time 8 Weeks
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