041699
Boyd Laconia LLCHeat Sink Passive TO-220 Radial Thru-Hole Aluminum 4.8A°C/W Black Anodized ...
DESCRIPTION
The 532702B02500G is a dual radial, board-level heat sink from the High Power Extruded 5320 series, intended for thermal management of electronic components. It is specifically designed to cool TO-220 and TO-220-single gauge semiconductor devices. Constructed from aluminum with a black anodize finish for durability and thermal performance, this heat sink measures 41.91 mm in width, 25.40 mm in length, and has a height of 50.80 mm. Designed for vertical mounting on a printed circuit board, it is ideal for high-power applications where efficient heat dissipation from power transistors or regulators is critical to ensure system reliability.
Search Keywords: 041699
SPECIFICATIONS
IN STOCK: 2,920
Can Ship immediately
Minimum Order Quantity: 5
Factory Lead-Time 9 Weeks
English
Chinese
Spanish
