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041639 by boyd laconia llc
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041639

Boyd Laconia LLC

Heat Sink Passive D PAK/TO-252 SMD Aluminum 25A°C/W Tin ...

Datasheet
RoHS Compliant
Packaging
Accessories
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DESCRIPTION

The 573100D00010G is a surface mount board level heat sink engineered to dissipate heat from D-Pak and TO-252 packaged semiconductor devices. Constructed from aluminum with a tin-plated finish, this heat sink features dimensions of 8.00 mm width × 10.16 mm length × 22.86 mm height and is mounted horizontally on the printed circuit board. The design includes a recommended copper heat spreader drain pad (14.0 mm × 9.5 mm) and solder mask opening (13.5 mm × 8.9 mm) to optimize thermal coupling and board integration. This heat sink is ideal for applications requiring efficient thermal management of power semiconductors in compact surface-mount assemblies, offering improved heat dissipation performance across varying air velocity conditions.

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SPECIFICATIONS

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Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
041639
Alias/AKA:
573100D00010G
Unit of Measure:
Per Each
RoHS:
Yes
COO:
CN
ECCN:
EAR99
Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
1

IN STOCK: 4,525

Can Ship immediately

MOQ for In Stock Qty: 10

MOQ for out of Stock Qty: 1125

Factory Lead-Time 9 Weeks

Price (USD)

Qty
Unit Price
10
$1.100
250
$0.977
500
$0.943
1,125
$0.922
2,250
$0.917
3,375
$0.913
4,500 +
$0.908
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