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041548 by boyd laconia llc
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041548

Boyd Laconia LLC

Heat Sink Passive TO-218 Radial Thru-Hole Aluminum 5.5A°C/W Black Anodized ...

RoHS Compliant
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DESCRIPTION

529701B02500G is a dual radial board level heat sink engineered to cool TO-218 semiconductor devices. The heat sink is constructed from aluminum with black anodize finishing and features a vertical mounting orientation. Key dimensions include a width of 41.91 mm, length of 25.40 mm, and height ("A" dimension) of 25.40 mm, with additional dimensional parameters of "B" = 21.59 mm and "C" = 3.66 mm. The device requires a mounting kit for attachment and is RoHS compliant. This heat sink is ideal for applications requiring efficient thermal management of power semiconductors in compact board-level designs, offering reliable heat dissipation through its dual radial fin structure.

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SPECIFICATIONS

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Products found: 0
Supplier:
Boyd Laconia LLC
Part No:
041548
Alias/AKA:
529701B02500G
Unit of Measure:
Per Each
RoHS:
Yes
COO:
CN
ECCN:
EAR99
Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
240

IN STOCK: 320

Can Ship immediately

Minimum Order Quantity: 10

Factory Lead-Time 6 Weeks

Price (USD)

Qty
Unit Price
10
$1.88
50
$1.40
240
$1.34
480
$1.32
720
$1.31
1,200 +
$1.30

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