DILB18P-223TLF
DIP Socket - 18 (2 x 9) Position - 0.3" (7.62mm) Row Spacing - 0.100" (2.54mm) Pitch - Open Frame - Solder Termination - Through Hole. ...
DESCRIPTION
The DILB18P-223TLF from Amphenol Communications Solutions is through hole mounting DIP socket with 18 (2 x 9) position, 0.3" (7.62mm) row spacing, 0.100" (2.54mm) pitch and solder termination. This open frame socket has copper alloy contacts with 100.0µin (2.54µm) tin-lead finish and polyamide (PA), nylon housing. Operating temperature range is from -55°C to 125°C.
Search Keywords: DILB18P223TLF
SPECIFICATIONS
FREQUENTLY ASKED QUESTIONS
Is DILB18P-223TLF RoHS compliant?
Yes, DILB18P-223TLF is RoHS compliant.
What is the lead time for DILB18P-223TLF?
The standard lead time for DILB18P-223TLF is approximately 9 weeks. In-stock quantities ship from Master Electronics.
IN STOCK: 44,824
Can Ship immediately
Minimum Order Quantity: 200
Factory Lead-Time 9 Weeks
English
中文 / 汉语
Deutsch
Español
Nederlands
