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60-3-10

Chemtronics

Desoldering Braid - Soder-Wick® - No-Clean - Green - Static Dissipative Bobbin - 2mm x 10ft. .. see full description

  • RoHS Non-Compliant
  • PACK Packaging
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Supplier:
Chemtronics
Part No:
60-3-10
RoHS:
No
HTS:
7413001000
ECCN:
EAR99
Package Type:
PACK
The 60-3-10 is a Soder-Wick® No Clean Desoldering Braid designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-Wick® No Clean uses pure, oxygen-free copper braid and a patented flux technology to make an efficient and effective desoldering braid. Soder-Wick® No Clean SD is available on ESD safe bobbins for protection against damage due to static electricity. The Soder-Wick® No Clean SD safely removes solder in all applications requiring type ROL0 flux. BGA braid sized and designed specifically for BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes. The Soder-Wick® No Clean safely removes solder from micro circuits, surface mount device pads, ball grid array pads, lugs and posts.
Search Keywords:
60310
IN STOCK: 13
Can Ship immediately
Minimum Order:
5
Factory Lead-Time
3 Weeks
Enter Quantity
Quantity
Unit Price
Ext. Price
5
$10.28
$51.400
25
$9.34
$233.500
50
$8.94
$447.000
100
$8.69
$869.000
250
$8.23
$2,057.500
500
$8.02
$4,010.000
1,000 +
$7.90
$7,900.000
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