60-3-10
ChemtronicsDesoldering Braid - Soder-Wick® - No-Clean - Green - Static Dissipative Bobbin - 2mm x 10ft. .. see full description
Supplier:
Chemtronics
Part No:
60-3-10
RoHS:
No
HTS:
7413001000
ECCN:
EAR99
Package Type:
PACK
The 60-3-10 is a Soder-Wick® No Clean Desoldering Braid designed to provide fast and safe desoldering without leaving behind harmful flux residues. Soder-Wick® No Clean uses pure, oxygen-free copper braid and a patented flux technology to make an efficient and effective desoldering braid. Soder-Wick® No Clean SD is available on ESD safe bobbins for protection against damage due to static electricity. The Soder-Wick® No Clean SD safely removes solder in all applications requiring type ROL0 flux. BGA braid sized and designed specifically for BGA pad and chip rework/repair so entire BGA pads cleaned in three to four passes. The Soder-Wick® No Clean safely removes solder from micro circuits, surface mount device pads, ball grid array pads, lugs and posts.