7141DG
Heat Sink Passive TO-220 Vertical Thru-Hole Copper 20.3A°C/W Matte Tin ...
DESCRIPTION
The 7141DG is a narrow channel board level heat sink engineered to cool TO-220 and TO-220-single gauge semiconductor devices. Constructed from copper with a tin-plated finish, it features an integrated mounting clip for secure device attachment and is mounted vertically on the board. The heat sink measures 13.21 mm in width, 13.08 mm in length, and 19.81 mm in height, with dimensional specifications including a "y" dimension of 0.33 mm and a "z" dimension of 2.77 mm. This compact design provides effective thermal management for power devices, with thermal performance varying based on air velocity, making it suitable for applications requiring efficient heat dissipation in space-constrained environments. The product is RoHS compliant, ensuring environmental and regulatory compliance.
Search Keywords: 7141DG
SPECIFICATIONS
FREQUENTLY ASKED QUESTIONS
Is 7141DG RoHS compliant?
Yes, 7141DG is RoHS compliant.
What is the lead time for 7141DG?
The standard lead time for 7141DG is approximately 6 weeks. In-stock quantities ship from Master Electronics.
IN STOCK: 3,188
Can Ship immediately
MOQ for In Stock Qty: 10
MOQ for out of Stock Qty: 875
Factory Lead-Time 6 Weeks
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