7021B-8223-CL03G
Boyd Laconia LLCThe 7021B-8223-CL03G is a channel-style, board-level heat sink with a factory-applied alignment pad for TO-220 semiconductor packages. ...
DESCRIPTION
The 7021B-8223-CL03G is a channel-style heat sink designed for cooling TO-220 packages, featuring factory-applied solderable alignment pads to simplify and accelerate assembly. Constructed from 1.27 mm thick aluminum with a black anodize finish, this heat sink utilizes folded back fins to maximize the cooling surface area and achieves a natural convection thermal resistance of 6.8 °C/W. The pre-applied alignment pads are an innovative feature that can significantly reduce assembly time, providing a cost-effective and reliable method for attaching the heat sink to the transistor and PCB. This makes it an ideal solution for board-level thermal management in various electronic applications.
Search Keywords: 7021B8223CL03G
SPECIFICATIONS
IN STOCK: 235
Can Ship immediately
MOQ for In Stock Qty: 10
MOQ for out of Stock Qty: 10
Factory Lead-Time 9 Weeks
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