573300D00010G
Heat Sink Passive D2 PAK/TO-263 SMD Aluminum Black Anodized ...
DESCRIPTION
The 573300D00010G is a 26.16mm surface mount Heat Sink with copper construction, tin-plated finish, 18°C/W thermal resistance. This heat sink non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component. It features no attachment holes required in the printed circuit board, 100% matte tin plating with nickel underplate, wing configuration will not interfere with adjacent components, their unique design removes heat indirectly through conduction without making contact with the SMT device like traditional through hole solutions. Compatible with both tin-lead and lead free (Sn/Ag/Cu) solders. Suitable for power supplies, telecommunication equipment, motor Controls, medical equipment, industrial process control equipment and consumer products applications.
Search Keywords: 573300D00010G
SPECIFICATIONS
FREQUENTLY ASKED QUESTIONS
Is 573300D00010G RoHS compliant?
Yes, 573300D00010G is RoHS compliant.
What is the lead time for 573300D00010G?
The standard lead time for 573300D00010G is approximately 10 weeks. In-stock quantities ship from Master Electronics.
IN STOCK: 414
Can Ship immediately
On Order:
25,000
can ship 11/18/26
On Order:
25,000
can ship 11/30/26
MOQ for In Stock Qty: 5
MOQ for out of Stock Qty: 750
Factory Lead-Time 10 Weeks
Price (USD)
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