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532602B02500G by boyd laconia llc
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Boyd Laconia LLC 授权经销商

532602B02500G

The 532602B02500G is an extruded aluminum, dual radial board-level heat sink designed for cooling TO-220 and TO-220-single gauge devices. ...

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符合 RoHS
Bulk 包装
附件
请求编程报价
合规证书

描述

The 532602B02500G is a dual radial board-level heat sink intended for cooling TO-220 and TO-220-single gauge semiconductor packages. Constructed from aluminum with a black anodize finish, it provides effective thermal management for high-power components. This heat sink is designed for vertical mounting and has dimensions of 41.91 mm in width, 25.40 mm in length, and 38.10 mm in height. It is suitable for board-level cooling applications where efficient heat dissipation is critical for system reliability and performance.

搜索关键词: 532602B02500G

规格

产品属性
属性值
选择属性
找到的产品: 0
供应商:
Boyd Laconia LLC
部件编号:
532602B02500G
别名/又称:
041681
计量单位:
每 Each
RoHS:
Yes
HTS:
8473305100
COO:
CN
ECCN:
EAR99
供应商标准包装: 此信息提供给偏好按制造商标准包装数量的倍数购买的客户。最小订购数量和要求的订购倍数会与我们的价格和库存信息一起显示。
1
封装类型:
Bulk
器件冷却方式:
TO-220
安装方式:
N/A
尺寸:
41.91 x 25.4 x 38.1 mm
热阻:
5.5 °C/W
表面处理:
Black Anodized

常见问题

532602B02500G 是否符合 RoHS 标准？

是的，532602B02500G 符合 RoHS 标准。

532602B02500G 的交货期是多少？

532602B02500G 的标准交货期约为 9 天。有库存的数量由 Master Electronics 发货。

有存货: 2,035

可立即发货

已订购: 2,040   可以发货 10/5/26 

最小订购数量: 5

工厂交货期 9 周

价格 (USD)

数量
单价
5
$3.742
25
$2.950
50
$2.711
240
$2.429
480
$2.361
720
$2.355
1,200
$2.283
4,080 +
$2.277
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