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042648 by boyd laconia llc
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042648

Boyd Laconia LLC

Heat Sink Passive TO-220 Vertical Thru-Hole Copper 20.3A°C/W Matte Tin ...

Datasheet
RoHS Compliant
Packaging
Accessories
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This product is backed by Master Electronics' Certificate of Compliance Guarantee. Rest assured you will receive the Manufacturer's Certificate of Compliance with your order. Certificate of Compliance Guarantee

DESCRIPTION

The 7141DG is a narrow channel board level heat sink engineered to cool TO-220 and TO-220-single gauge semiconductor devices. Constructed from copper with a tin-plated finish, it features an integrated mounting clip for secure device attachment and is mounted vertically on the board. The heat sink measures 13.21 mm in width, 13.08 mm in length, and 19.81 mm in height, with dimensional specifications including a "y" dimension of 0.33 mm and a "z" dimension of 2.77 mm. This compact design provides effective thermal management for power devices, with thermal performance varying based on air velocity, making it suitable for applications requiring efficient heat dissipation in space-constrained environments. The product is RoHS compliant, ensuring environmental and regulatory compliance.

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SPECIFICATIONS

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Supplier:
Boyd Laconia LLC
Part No:
042648
Alias/AKA:
7141DG
Unit of Measure:
Per Each
RoHS:
Yes
COO:
CN
ECCN:
EAR99
Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
3500

IN STOCK: 3,198

Can Ship immediately

Minimum Order Quantity: 10

Factory Lead-Time 6 Weeks

Price (USD)

Qty
Unit Price
10
$2.98
50
$2.85
100
$2.79
250
$2.72
500
$2.66
1,000
$2.60
3,500 +
$2.50
Suppliers Standard Package
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