041548
Boyd Laconia LLCHeat Sink Passive TO-218 Radial Thru-Hole Aluminum 5.5A°C/W Black Anodized ...
DESCRIPTION
529701B02500G is a dual radial board level heat sink engineered to cool TO-218 semiconductor devices. The heat sink is constructed from aluminum with black anodize finishing and features a vertical mounting orientation. Key dimensions include a width of 41.91 mm, length of 25.40 mm, and height ("A" dimension) of 25.40 mm, with additional dimensional parameters of "B" = 21.59 mm and "C" = 3.66 mm. The device requires a mounting kit for attachment and is RoHS compliant. This heat sink is ideal for applications requiring efficient thermal management of power semiconductors in compact board-level designs, offering reliable heat dissipation through its dual radial fin structure.
Search Keywords: 041548
SPECIFICATIONS
IN STOCK: 320
Can Ship immediately
Minimum Order Quantity: 10
Factory Lead-Time 6 Weeks
English
Chinese
Spanish
