036256
Boyd Laconia LLCFilm Capacitor, 0.056 uF, 160 V, 630 V, ± 5%, Metallized PET, Radial Box - 2 Pin ...
DESCRIPTION
This BOYD LACONIA LLC Heat Sinks Semiconductor Pad is designed for circuits, specifically for use with DAP applications. It features 8 leads, a 10.92mm outer diameter, and is 3.30mm thick, making it ideal for effectively dissipating heat from semiconductor devices. This high-quality pad ensures optimal performance and longevity for your electronic components.
Search Keywords: 036256
SPECIFICATIONS
IN STOCK: 1,517
Can Ship immediately
Minimum Order Quantity: 25
Factory Lead-Time 16 Weeks
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