BB1110TB7
BI Technologies/TT ElectronicsRes NET 50 Ohm/25 Ohm 1% 1W ±200ppm/°C BUS Molded 27-Pin BGA Ball SMD T/R ...
DESCRIPTION
BB1110TB7 is an 18-bit SSTL_2 termination network designed for DDR SDRAM applications, compliant with JEDEC Standard 8-9B. The device features a 3×9 resistor array with R1/R2 values of 50O and 25O respectively, achieving superior high-frequency performance through minimal stray capacitance and inductance by placing resistors and BGA termination on the same side of the ceramic substrate. With an operating temperature range of -55°C to +125°C, absolute tolerance of 1%, and temperature coefficient of 200 ppm/°C, the network delivers reliable performance across demanding environments. The solder ball flip chip attachment enables easy surface mounting using automatic Pick and Place equipment, making it ideal for high-speed DDR bus termination in memory systems requiring precise impedance matching and signal integrity.
Search Keywords: BB1110TB7
SPECIFICATIONS
IN STOCK: 4,788
Can Ship immediately
Minimum Order Quantity: 5
Multiple: 5
English
Chinese
Spanish
