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17EHD015SAM000
D-Sub High Density Conn SOL CUP HI DENSITY F 15P ...
DESCRIPTION
The 17EHD015SAM000 is a high-density D-sub connector in 15-pin size featuring solder cup termination with through-hole mounting. The connector is constructed with a nickel-plated steel shell and engineering thermoplastic PBT inserts with glass reinforcement (UL 94V-0 rated), ensuring durability and flame resistance. Contacts are copper alloy with gold plating over nickel, rated for 3 A current with a maximum contact resistance of 15 milliohms and insulation resistance of 3000 megohms minimum. The connector operates reliably across a temperature range of -55°C to +105°C and withstands 1000 VAC rms dielectric voltage, making it suitable for industrial control systems, telecommunications equipment, and data acquisition applications requiring robust, high-density interconnections.
Search Keywords: 17EHD015SAM000
SPECIFICATIONS
FREQUENTLY ASKED QUESTIONS
Is 17EHD015SAM000 RoHS compliant?
Yes, 17EHD015SAM000 is RoHS compliant.
What is the lead time for 17EHD015SAM000?
The standard lead time for 17EHD015SAM000 is approximately 10 days. In-stock quantities ship from Master Electronics.
IN STOCK: 980
Can Ship immediately
You may purchase all in-stock quantity of 980
Stock lot only: 980
MOQ for In Stock Qty: 5000
MOQ for out of Stock Qty: 5000
Factory Lead-Time 10 Weeks
Datasheet