ATS-60001-C1-R0
37.6 x 37.6 x 4.0 mm BGA Heat Sink - High Performance Ultra Low Profile 4.0 mm high adhesive thermal tape blue anodized aluminum ...
DESCRIPTION
The ATS-60001-C1-R0 is a high-performance, ultra-low profile BGA heat sink designed by Advanced Thermal Solutions, Inc. It has a compact size of 37.6 x 37.6 x 4.0 mm, making it ideal for space-constrained applications. Constructed from blue anodized aluminum, this heat sink offers excellent heat dissipation and enhanced durability. It features a 4.0 mm height to efficiently cool high-power BGA devices. Equipped with a high-quality adhesive thermal tape, the ATS-60001-C1-R0 can be easily mounted onto your BGA components, providing an efficient thermal connection for optimal heat transfer. Whether used in consumer electronics, telecommunications, or industrial applications, this BGA heat sink can effectively keep your components cool and ensure their reliable operation.
Search Keywords: ATS60001C1R0
SPECIFICATIONS
FREQUENTLY ASKED QUESTIONS
Is ATS-60001-C1-R0 RoHS compliant?
Yes, ATS-60001-C1-R0 is RoHS compliant.
What is the lead time for ATS-60001-C1-R0?
The standard lead time for ATS-60001-C1-R0 is approximately 8 weeks. In-stock quantities ship from Master Electronics.
IN STOCK: 0
Manufacturer Stock: 122 can ship 10/19/26
MOQ for out of Stock Qty: 25
Factory Lead-Time 8 Weeks can ship 11/27/26
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